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Keywords = AZ 15nXT

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11 pages, 2419 KB  
Communication
Sacrificial Layer Technique for Releasing Metallized Multilayer SU-8 Devices
by Anand Tatikonda, Ville P. Jokinen, Hanno Evard and Sami Franssila
Micromachines 2018, 9(12), 673; https://doi.org/10.3390/mi9120673 - 19 Dec 2018
Cited by 8 | Viewed by 8886
Abstract
The low fabrication cost of SU-8-based devices has opened the fields of point-of-care devices (POC), µTAS and Lab-on-Chip technologies, which call for cheap and disposable devices. Often this translates to free-standing, suspended devices and a reusable carrier wafer. This necessitates a sacrificial layer [...] Read more.
The low fabrication cost of SU-8-based devices has opened the fields of point-of-care devices (POC), µTAS and Lab-on-Chip technologies, which call for cheap and disposable devices. Often this translates to free-standing, suspended devices and a reusable carrier wafer. This necessitates a sacrificial layer to release the devices from the substrates. Both inorganic (metals and oxides) and organic materials (polymers) have been used as sacrificial materials, but they fall short for fabrication and releasing multilayer SU-8 devices. We propose photoresist AZ 15nXT (MicroChemicals GmbH, Ulm, Germany) to be used as a sacrificial layer. AZ 15nXT is stable during SU-8 processing, making it suitable for fabricating free-standing multilayer devices. We show two methods for cross-linking AZ 15nXT for stable sacrificial layers and three routes for sacrificial release of the multilayer SU-8 devices. We demonstrate the capability of our release processes by fabrication of a three-layer free-standing microfluidic electrospray ionization (ESI) chip and a free-standing multilayer device with electrodes in a microchannel. Full article
(This article belongs to the Special Issue SU-8 for Microfluidics and Lab-on-a-chip)
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