Advances in Eddy Current Non-destructive Testing

A special issue of NDT (ISSN 2813-477X).

Deadline for manuscript submissions: closed (30 June 2024) | Viewed by 910

Special Issue Editor


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Guest Editor
Department of Mechanical Engineering, University of Bristol, Bristol BS8 1TH, UK
Interests: electreomagnetic NDT; composites modelling and testing
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Special Issue Information

Dear Colleagues,

Eddy current non-destructive testing (ECT) is a technique widely applied in order to detect surface and sub-surface flaws in conductive materials without causing any damage. The Special Issue on “Advances in Eddy Current Non-destructive Testing” aims to provide an in-depth overview of the latest developments in the field. The articles in this Special Issue attend to a wide range of topics, including the following:

  • Advanced sensor/sensor array design: This includes the application novel materials, such as graphene or carbon nanotubes, to create more sensitive and selective sensors. It also includes the development of new sensor geometries, such as flexible or conformal sensors, that can be employed to inspect complex surfaces or geometries. It also includes development of novel excitation techniques, including chirp/multiple resonance, for advanced sensing.
  • Eddy current data processing and automatic evaluation: This includes the application of machine learning/AI to analyze eddy current data, as well as the development of novel data processing and visualization techniques.
  • Industrial applications: This includes the application of the eddy current testing of complex materials, such as composites or additive manufacturing materials, as well as the inspection of oil and gas pipelines or other industrial structures.
  • Multimodal sensing: Multimodal sensing, which combines eddy current with other sensing modalities, such as ultrasonic or thermal imaging, is being utilized more frequently. This can provide a more comprehensive picture of a material or structure, and can enhance the accuracy and sensitivity of inspections.
  • Miniaturization and portability: Finally, developments regarding the miniaturization and portability of eddy current sensors and systems are garnering increasing interest. This includes the development of handheld or mobile systems that can be employed in the field, as well as the integration of sensors into small or portable devices for medical or other applications.

In conclusion, the Special Issue on “Advances in Eddy Current Non-destructive Testing” provides a comprehensive overview of the latest developments in ECT technology. We are hoping to identify the crucial ability of eddy currents to improve enhance efficiency, minimize waste and costs, and support sustainable manufacturing and energy systems.

Dr. Qiuji Yi
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • non-destructive testing
  • advanced sensor/sensor array design
  • eddy current data processing and automatic evaluation
  • industrial applications
  • multimodal sensing
  • miniaturization and portability

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Published Papers

There is no accepted submissions to this special issue at this moment.
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