Advancements in Micro-Electro-Mechanical Systems (MEMS): Materials, Intelligence, and Integration for Next-Generation Industrial Applications
A special issue of Inventions (ISSN 2411-5134). This special issue belongs to the section "Inventions and Innovation in Electrical Engineering/Energy/Communications".
Deadline for manuscript submissions: 20 November 2025 | Viewed by 108
Special Issue Editors
Interests: semiconductor devices; sensors; silicon carbide
Special Issue Information
Dear Colleagues,
Micro-Electro-Mechanical Systems (MEMS) have emerged as the backbone of smart, connected technologies, driving innovation across industrial sectors including aerospace, automotive, healthcare, and telecommunications. As industries move toward automation, data-driven decision-making, and miniaturized intelligent systems, MEMS technologies are being reimagined with new materials, intelligent functionalities, and advanced integration strategies.
Recent breakthroughs in MEMS materials—ranging from wide-bandgap semiconductors and piezoelectric thin films to flexible and biocompatible substrates—are enabling devices to operate in extreme and dynamic environments. In parallel, the fusion of MEMS with Artificial Intelligence (AI) and the Internet of Things (IoT) is empowering edge-level sensing, real-time analytics, and autonomous decision-making. Moreover, new packaging paradigms such as 3D integration and wafer-level bonding are enabling compact, high-performance MEMS-based microsystems.
This Special Issue will highlight cutting-edge research that advances the materials, design, intelligence, and integration aspects of MEMS with a clear focus on industrial relevance and application readiness. The objective is to curate impactful contributions that demonstrate scalability, robustness, and novel functionalities tailored to modern industrial needs.
To gather original, high-quality research and review articles that demonstrate transformative advancements in MEMS technologies, especially those targeting real-world industrial applications through innovations in materials, AI integration, and system-level packaging.
This Special Issue invites contributions in, but not limited to, the following areas:
- MEMS for Industrial Applications: sensors, actuators, energy harvesters;
- Advanced MEMS Materials: piezoelectric, wide-bandgap, flexible materials;
- Intelligent MEMS: AI-enhanced sensing, neuromorphic integration, edge computing;
- RF MEMS: low-loss switches, tunable components for 5G/6G and radar;
- MEMS for Harsh Environments: high-temperature, radiation-hardened, corrosion-resistant systems;
- MEMS + IoT: autonomous sensing platforms, wireless interfaces, edge-to-cloud integration;
- 3D MEMS Packaging: heterogeneous integration, wafer-level encapsulation, chiplet-based systems;
- Industry Trends and Roadmaps: manufacturability, reliability, and commercialization strategies.
We invite original research articles, comprehensive reviews, and impactful case studies that showcase how recent advancements in MEMS are driving innovation across industries. This Special Issue seeks to promote interdisciplinary collaboration and ignite fresh ideas by bringing together leading voices from academia and industry to push the boundaries of MEMS technology and its real-world applications.
Dr. Vibhor Kumar
Dr. Yogesh Kumar Singla
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Inventions is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- micro-electro-mechanical systems (MEMS)
- sensors
- actuators
- energy harvesters
- AI-enhanced sensing
- neuromorphic integration
- edge computing
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