Announcements

We are pleased to announce that new scholars have been appointed as Editorial Board Members (EBMs) for AI Materials (ISSN: 3042-6715) in the first quarter of 2026. We wish our new members success in both their research and their efforts to develop the journal.

Name: Dr. Bohayra Mortazavi
Affiliation: Institute of Photonics, Department of Mathematics and Physics, Leibniz Universität Hannover, Germany
Interests: machine learning-assisted materials modeling; computational materials science; multiscale modeling; data-driven modeling; 2D materials

Name: Prof. Dr. Stephan Roche
Affiliation: Catalan Institute of Nanoscience and Nanotechnology - ICN2 (CSIC and BIST), Spain
Interests: theoretical physics; graphene; Dirac matter; linear scaling quantum transport methods; topological insulators; Weyl semimetals; multiscale simulations; machine learning; van der Waals heterostructures; spin transport; spin hall effect; spin torques

Name: Prof. Dr. Doo Yeol Yoo
Affiliation: Department of Architecture and Architectural Engineering, Yonsei University, Republic of Korea
Interests: ultra-high-performance concrete (UHPC); eco-friendly fiber-reinforced composites; AI for construction materials

Name: Dr. José R. B. Gomes
Affiliation: CICECO—Aveiro Institute of Materials, Department of Chemistry, University of Aveiro, Campus Universitário de Santiago, Portugal
Interests: molecular structure; gas-phase thermochemistry; gas-phase reaction profiles; adsorption (chemisorption and physisorption); surface reactions; heterogeneous catalysis; machine learning

Name: Prof. Dr. Qing Wang
Affiliation: School of Materials Science and Engineering, Dalian University of Technology, China
Interests: alloy design; high-entropy alloys; superalloys; special stainless steels; Ti/Zr alloys; machine learning

AI Materials is currently recruiting Editorial Board Members who will primarily focus on artificial intelligence and experimental research in materials science. Please contact the Editorial Office if you are interested in this position.