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Editorial

Journal Editorial: Welcome to the New Era of AI-Enabled Sensing

by
Ting Leng
1,
Lin Li
1,* and
Chengkuo Lee
2,*
1
MDPI AG, Grosspeteranlage 5, 4052 Basel, Switzerland
2
Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
*
Authors to whom correspondence should be addressed.
AI Sens. 2025, 1(1), 1; https://doi.org/10.3390/aisens1010001
Submission received: 5 February 2025 / Accepted: 10 February 2025 / Published: 11 February 2025
Versions Notes
Artificial intelligence (AI) has been under the spotlight for scientific research in recent years. Many key applications and technological developments also revolve around AI. As AI continues to transform our world, the integration of AI sensors is becoming increasingly essential. By combining AI technology, edge computing, and Internet of things (IoT) sensing technologies, sensors providing massive amounts of sensory information to servers ranging from edge computing to cloud computing will enable the development of next-generation artificial intelligence of things (AIoT) technology and pave the way for future applications such as AI robots, digital twins, e-healthcare, and digital humans [1,2,3,4,5,6,7,8,9,10,11,12,13,14,15,16].
AI Sensors (https://www.mdpi.com/journal/aisens (accessed on 9 Feburary 2025), ISSN: 3042-5999) is an international, peer-reviewed, scholarly, open-access MDPI journal that will discuss the full range of AI sensing technologies. We aim to provide a platform for researchers, engineers, and innovators to explore and share their cutting-edge developments, insights, and breakthroughs in the field of AI sensing technologies, with a particular focus on edge computing, in-sensor computing, cloud computing, and AIoT-enabled sensing. In this Editorial, we would like to introduce our journal, its background, and our mission.
The 1st International Conference on AI Sensors and the 10th International Symposium on Sensor Science (AIS and I3S 2024) were held successfully in Singapore at the National University of Singapore on 1–4 August 2024. The events attracted over 380 attendees, with researchers and industry experts from China, Singapore, Japan, Korea, Italy, the UK, the USA, India, and other countries sharing their latest findings. It was during this event that we had the privilege of spending some quality time with our chair, Prof. Dr. Chengkuo Lee. Prof. Lee is a pioneer in AI-enabled sensing technologies, with a strong focus on wearable sensors, flexible electronics, photonics sensors, MEMS, and NEMS. His iconic publications on AI-enabled wearable sensing technologies have become beacons in this research field and have been the subject of significant attention and substantial citations [1,17,18].
When co-organising AIS and I3S 2024, our senior publishers, Lin Li and Mengdie Hu, had a discussion with Prof. Lee about the possibility of launching a new branch of the journal Sensors. As AI sensing technologies develop, we will need a dedicated platform, rather than a sub-section, to accommodate all the excellent advancements that will be achieved. Prof. Lee approved of this idea and offered us a number of suggestions, including a blueprint of the aims and scope of the journal. Lin and Mengdie were moved by his enthusiasm and dedication to this research field, as well as his professionalism and interest in exploring future opportunities to work with MDPI. These are the fundamental qualities that we look for in MDPI collaborators, and this is why we have entrusted our brand-new journal AI Sensors to Prof. Lee’s leadership as Editor-in-Chief. A month later, Dr. Ting Leng was surprised and delighted to be appointed as Managing Editor. Ting spent years performing research on the integration of 2D materials and sensing applications at the University of Manchester. In 2019, he published his work on AI-sensing antennas [19], and now, 5 years later, he will be working on the same topic, but as a Managing Editor. With his appointment, the first editorial team for AI Sensors was formed, marking the beginning of this new journal.
As a new journal launched in this exciting era of AI, we are dedicated to providing a dynamic platform for sharing groundbreaking ideas and developments. Our mission is to uphold a rigorous yet efficient peer review process, ensuring that every published work meets the highest standards and that researchers, scholars, and practitioners can share their findings, exchange ideas, and collaborate to drive innovation.
The logo of AI Sensors has seen several iterations; the final version drew inspiration from Lin’s original idea of using neural networks to weave patterns and letters, in combination with sensing signals. Prof. Chengkuo Lee loved the idea and suggested using a vibrant colour to resemble the dynamic nature and bright future of research into AI technologies.
On behalf of the Editorial Office, we extend a warm welcome to all potential contributors and readers of AI Sensors. We hope that you enjoy our content, and we look forward to working closely with you to build a bright future for our journal.

Conflicts of Interest

The authors declare no conflict of interest.

References

  1. Zhu, M.; Sun, Z.; Zhang, Z.; Shi, Q.; He, T.; Liu, H.; Chen, T.; Lee, C. Haptic-feedback smart glove as a creative human-machine interface (HMI) for virtual/augmented reality applications. Sci. Adv. 2020, 6, eaaz8693. [Google Scholar] [CrossRef] [PubMed]
  2. Wen, F.; Zhang, Z.; He, T.; Lee, C. AI enabled sign language recognition and VR space bidirectional communication using triboelectric smart glove. Nat. Commun. 2021, 12, 5378. [Google Scholar] [CrossRef] [PubMed]
  3. Jin, T.; Sun, Z.; Li, L.; Zhang, Q.; Zhu, M.; Zhang, Z.; Yuan, G.; Chen, T.; Tian, Y.; Hou, X.; et al. Triboelectric nanogenerator sensors for soft robotics aiming at digital twin applications. Nat. Commun. 2020, 11, 5381. [Google Scholar] [CrossRef] [PubMed]
  4. Zhang, Q.; Jin, T.; Cai, J.; Xu, L.; He, T.; Wang, T.; Tian, Y.; Li, L.; Peng, Y.; Lee, C. Wearable Triboelectric Sensors Enabled Gait Analysis and Waist Motion Capture for IoT-Based Smart Healthcare Applications. Adv. Sci. 2022, 9, 2103694. [Google Scholar] [CrossRef] [PubMed]
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  17. Guo, X.; Sun, Z.; Zhu, Y.; Lee, C. Zero-Biased Bionic Fingertip E-Skin with Multimodal Tactile Perception and Artificial Intelligence for Augmented Touch Awareness. Adv. Mater. 2024, 36, e2406778. [Google Scholar] [CrossRef]
  18. Sun, Z.; Zhu, M.; Shan, X.; Lee, C. Augmented tactile-perception and haptic-feedback rings as human-machine interfaces aiming for immersive interactions. Nat. Commun. 2022, 13, 5224. [Google Scholar] [CrossRef]
  19. Leng, T.; Pan, K.; Zhang, Y.; Li, J.; Afroj, S.; Novoselov, K.S.; Hu, Z. Screen-Printed Graphite Nanoplate Conductive Ink for Machine Learning Enabled Wireless Radiofrequency-Identification Sensors. ACS Appl. Nano Mater. 2019, 2, 6197–6208. [Google Scholar] [CrossRef]
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MDPI and ACS Style

Leng, T.; Li, L.; Lee, C. Journal Editorial: Welcome to the New Era of AI-Enabled Sensing. AI Sens. 2025, 1, 1. https://doi.org/10.3390/aisens1010001

AMA Style

Leng T, Li L, Lee C. Journal Editorial: Welcome to the New Era of AI-Enabled Sensing. AI Sensors. 2025; 1(1):1. https://doi.org/10.3390/aisens1010001

Chicago/Turabian Style

Leng, Ting, Lin Li, and Chengkuo Lee. 2025. "Journal Editorial: Welcome to the New Era of AI-Enabled Sensing" AI Sensors 1, no. 1: 1. https://doi.org/10.3390/aisens1010001

APA Style

Leng, T., Li, L., & Lee, C. (2025). Journal Editorial: Welcome to the New Era of AI-Enabled Sensing. AI Sensors, 1(1), 1. https://doi.org/10.3390/aisens1010001

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