Frolov, S.M.; Smetanyuk, V.A.; Silantiev, A.S.; Sadykov, I.A.; Frolov, F.S.; Hasiak, J.K.; Shiryaev, A.A.; Sitnikov, V.E.
Thermo-Mechano-Chemical Processing of Printed Circuit Boards for Organic Fraction Removal. Waste 2024, 2, 153-168.
https://doi.org/10.3390/waste2020009
AMA Style
Frolov SM, Smetanyuk VA, Silantiev AS, Sadykov IA, Frolov FS, Hasiak JK, Shiryaev AA, Sitnikov VE.
Thermo-Mechano-Chemical Processing of Printed Circuit Boards for Organic Fraction Removal. Waste. 2024; 2(2):153-168.
https://doi.org/10.3390/waste2020009
Chicago/Turabian Style
Frolov, Sergey M., Viktor A. Smetanyuk, Anton S. Silantiev, Ilias A. Sadykov, Fedor S. Frolov, Jaroslav K. Hasiak, Alexey A. Shiryaev, and Vladimir E. Sitnikov.
2024. "Thermo-Mechano-Chemical Processing of Printed Circuit Boards for Organic Fraction Removal" Waste 2, no. 2: 153-168.
https://doi.org/10.3390/waste2020009
APA Style
Frolov, S. M., Smetanyuk, V. A., Silantiev, A. S., Sadykov, I. A., Frolov, F. S., Hasiak, J. K., Shiryaev, A. A., & Sitnikov, V. E.
(2024). Thermo-Mechano-Chemical Processing of Printed Circuit Boards for Organic Fraction Removal. Waste, 2(2), 153-168.
https://doi.org/10.3390/waste2020009
