Analyzing the Effects of Sewing Compression on Thermal Efficiency in Baffled Jackets with an Advanced Walking Thermal Manikin

Round 1

Reviewer 1 Report

Comments and Suggestions for Authors

A very good research on determining the thermal resistance/insulation of quilted jackets using a modified stitching design/plate in the sewing machine. It would be useful to know if the stitching plate is limited to a particular thickness of the insulation material used in this study. Is this newly raised stitch plate adjustable in height? Could the authors refer to standard Clo values using a reference? Also, it would be helpful to know if the external environmental conditions (air movements/ humidity/temperature) are measured while measuring thermal insulation values on the thermal manikin. The introduction section can improve on discussing similar research using thermal mannikin. Figure 12 needs to improve in the presentation and needs to be in high resolution. Conclusions section needs to highlight the significance of this work from an industry context. 

Author Response

Comment 1: It would be useful to know if the stitching plate is limited to a particular thickness of the insulation material used in this study

Thank you for your comment. Yes, the stitch plate in the first patent was limited to 12 mm uncompressed thickness. The information is added in lines 159/160 and 171/172.

Comment 2:  Is this newly raised stitch plate adjustable in height? 

Thank you for your comment. Yes, the stitch plate height is adjustable. Stitch plate height adjustment results in stitch height. The information is added in lines 159/160 and 171/172.

Comment 3: Could the authors refer to standard Clo values using a reference?

Thank you for highlighting this. More references are added between lines 305-309

Comment 4: Also, it would be helpful to know if the external environmental conditions (air movements/ humidity/temperature) are measured while measuring thermal insulation values on the thermal manikin.

Thank you for your comment. Yes, The thermal manikin measures the ambient conditions automatically.

Comment 5: The introduction section can improve on discussing similar research using thermal mannikin

Thank you for your comment. Few researches have been added as advised. They are added in lines 75-77.

Comment 6: Figure 12 needs to improve in the presentation and needs to be in high resolution.

It is probably because of PDF conversion, it is less visible, Otherwise, it is a high-quality image. I hope that the final output will be better. However, I have further increased resolutions.

Comment 7: The conclusions section needs to highlight the significance of this work from an industry context. 

Thank you for your comments. the application of the technology in an industrial context is added between lines 436-439.

 

Author Response File: Author Response.pdf

Reviewer 2 Report

Comments and Suggestions for Authors

Please supplement the following information:

Please provide a more detailed description of how Spacer Stitching is achieved.

Add the names of the following standards: ASTM F1291, ASTM F1720, EN 13537, EN 342 and ISO/DIS 15831.

The bibliography is very limited and should be expanded.

Author Response

Comment 1: Please provide a more detailed description of how Spacer Stitching is achieved.

Thank you for highlighting this point. The authors have added details on spacer stitching the first patent process between lines 153-164. Due to the ongoing patenting process, the details of the second patent submission can not be discussed in detail due to the protection of intellectual property rights. This is mentioned in lines 169-171.

Comment 2: Add the names of the following standards: ASTM F1291, ASTM F1720, EN 13537, EN 342 and ISO/DIS 15831.

Thank you for your comment. The details of standards are added in the bibliography.

Comment 3: The bibliography is very limited and should be expanded.

Thank you for identifying it. More references and new research are added in the bibliography for the introduction and subsequent section.

Author Response File: Author Response.pdf