A Hydrometallurgical Process for Cu Recovery from Printed Circuit Boards †
Abstract
:1. Introduction
2. Materials and Methods
2.1. Solid Characterization and Pretreatment Leaching
2.2. Leaching of Copper
2.3. Extraction and Stripping of Copper
3. Results
3.1. Pretreatment Leaching
3.2. Leaching of Copper
- A total of 2 M H2SO4 as leaching agent;
- A total of 3 mL/g H2O2 (30% w/w) as oxidizing agent;
- An S/L ratio of 0.1 g/mL;
- Two stages;
- Residence time of 4 h;
- No agitation.
3.3. Extraction and Stripping of Copper
4. Conclusions
- The PCB metallic fraction, after the removal of the plastic material, is a remarkable copper resource as its copper content exceeds 20% and can be treated hydrometallurgically.
- More than 98% of copper was recovered from the dust by oxidative leaching in two stages, using 2 M H2SO4, 3 mL H2O2 (30% w/w)/g dust, and a solid/liquid ratio of 0.1 g/mL of dust.
- The optimum pH for the copper solvent extraction with ACORGA M5640 was 1.5.
- Copper was extracted quantitatively from the pregnant solution in two stages by ACORGA M5640 organic reagent at equilibrium pH 1.5 and an A/O ratio of 1:1.
- Copper was stripped off the loaded organic phase quantitatively in two stages by 2 M HCl and at an A/O ratio of 1:1.
- The concentration of copper in the stripped liquor was 7.4 g/L, with all other impurities being less than 0.2 mg/L, thus allowing copper electrowinning.
Funding
Acknowledgments
References
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Metal | Initial Dust (% wt.) | Metallic Fraction after Separation (%wt.) | Solid Product after Pretreatment Leaching (%wt.) |
---|---|---|---|
Sn | 5.01 | 12.74 | 1.30 |
Cu | 5.19 | 23.86 | 37.60 |
Fe | 8.17 | 17.84 | 10.67 |
Zn | 1.90 | 3.36 | 1.68 |
Ni | 0.76 | 1.48 | 1.77 |
Pb | 1.53 | 6.28 | 7.45 |
Al | 3.18 | 3.29 | 1.04 |
Total | 26.50 | 68.85 | 61.51 |
H2SO4 Concentration | Cu Leaching Efficiency % |
---|---|
1 M | 62.4 |
2 M | 66.0 |
4 M | 45.6 |
Leaching Stage | Cu Recovery % |
---|---|
1 | 34.4 |
2 | 63.7 |
Total | 98.1 |
Metal | Concentration before Purification (g/L) | Concentration after Purification (g/L) |
---|---|---|
Cu | 18.8 | 13.8 |
Fe | 2.6 | 0.44 |
Zn | 1.0 | 0.32 |
Ni | 1.17 | 0.40 |
pH | Cu (mg/L) | Fe (mg/L) | Zn (mg/L) | Ni (mg/L) |
---|---|---|---|---|
1.5 | 1460 | 405 | 305 | 375 |
HCl (M) | Cu (mg/L) | Fe (mg/L) | Zn (mg/L) | Ni (mg/L) |
---|---|---|---|---|
2 | 7400 | 0.16 | 0.06 | 0.01 |
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Vlasopoulos, D.; Oustadakis, P.; Agatzini-Leonardou, S.; Tsakiridis, P.; Remoundaki, E. A Hydrometallurgical Process for Cu Recovery from Printed Circuit Boards. Mater. Proc. 2021, 5, 56. https://doi.org/10.3390/materproc2021005056
Vlasopoulos D, Oustadakis P, Agatzini-Leonardou S, Tsakiridis P, Remoundaki E. A Hydrometallurgical Process for Cu Recovery from Printed Circuit Boards. Materials Proceedings. 2021; 5(1):56. https://doi.org/10.3390/materproc2021005056
Chicago/Turabian StyleVlasopoulos, Dimitrios, Paschalis Oustadakis, Styliani Agatzini-Leonardou, Petros Tsakiridis, and Emmanouella Remoundaki. 2021. "A Hydrometallurgical Process for Cu Recovery from Printed Circuit Boards" Materials Proceedings 5, no. 1: 56. https://doi.org/10.3390/materproc2021005056
APA StyleVlasopoulos, D., Oustadakis, P., Agatzini-Leonardou, S., Tsakiridis, P., & Remoundaki, E. (2021). A Hydrometallurgical Process for Cu Recovery from Printed Circuit Boards. Materials Proceedings, 5(1), 56. https://doi.org/10.3390/materproc2021005056