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Journal: Eng. Proc., 2023
Volume: 56
Number: 230

Article: Evaluating Stresses in SiO2 Thin Films Using Molecular Dynamics Simulations
Authors: by Sachin Shendokar, Nikhil Ingle, Ram Mohan and Shyam Aravamudhan
Link: https://www.mdpi.com/2673-4591/56/1/230

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