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Journal: Eng. Proc., 2023
Volume: 52
Number: 27

Article: Assembly of Fine-Pitch Package Integrated Circuits in a Laminated Transfer Process for E-Textile Applications
Authors: by Yi Li, Thomas Greig, Abiodun Komolafe, Russel Torah and Steve Beeby
Link: https://www.mdpi.com/2673-4591/52/1/27

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