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Editorial

Statement of Peer Review †

1
Department of Electronic Engineering, National Formosa University, Yunlin 632, Taiwan
2
Department of Electrical Engineering, Tamkang University, New Taipei City 251, Taiwan
3
Department of Chemical and Materials Engineering, National University of Kaohsiung, Kaohsiung 811, Taiwan
4
Department of Aeronautical Engineering, Chaoyang University of Technology, Taichung 413, Taiwan
*
Authors to whom correspondence should be addressed.
All proceeding papers published in this volume were presented at the 2025 IEEE 5th International Conference on Electronic Communications, Internet of Things and Big Data, New Taipei, Taiwan, 25–27 April 2025.
Eng. Proc. 2025, 108(1), 52; https://doi.org/10.3390/engproc2025108052
Published: 25 September 2025
In submitting conference proceedings of the 2025 IEEE 5th International Conference on Electronic Communications, Internet of Things and Big Data (IEEE ICEIB 2025) to Engineering Proceedings, the volume editors of the proceedings certify to the publisher that all papers published in this volume have been subjected to peer review administered by the volume editors. Reviews were conducted by expert referees to the professional and scientific standards expected of a proceedings journal.
  • Type of peer review: 2–3 reviews by double-blind;
  • Conference submission management system: online submission system on conference homepage;
  • Number of submissions sent for review: 154;
  • Number of submissions accepted: 53;
  • Acceptance rate: 0.34;
  • Total number of reviewers involved: 50;
  • Any additional information on the review process: Please refer to Figure 1.
Figure 1. Review process for conference proceedings of the 2025 IEEE 5th International Conference on Electronic Communications, Internet of Things and Big Data (IEEE ICEIB 2025).
Figure 1. Review process for conference proceedings of the 2025 IEEE 5th International Conference on Electronic Communications, Internet of Things and Big Data (IEEE ICEIB 2025).
Engproc 108 00052 g001

Conflicts of Interest

The authors declare no conflicts of interest.
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MDPI and ACS Style

Meen, T.-H.; Liao, S.-H.; Yang, C.-F. Statement of Peer Review. Eng. Proc. 2025, 108, 52. https://doi.org/10.3390/engproc2025108052

AMA Style

Meen T-H, Liao S-H, Yang C-F. Statement of Peer Review. Engineering Proceedings. 2025; 108(1):52. https://doi.org/10.3390/engproc2025108052

Chicago/Turabian Style

Meen, Teen-Hang, Shu-Han Liao, and Cheng-Fu Yang. 2025. "Statement of Peer Review" Engineering Proceedings 108, no. 1: 52. https://doi.org/10.3390/engproc2025108052

APA Style

Meen, T.-H., Liao, S.-H., & Yang, C.-F. (2025). Statement of Peer Review. Engineering Proceedings, 108(1), 52. https://doi.org/10.3390/engproc2025108052

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