Hardware Challenges in AI Sensors and Innovative Approaches to Overcome Them †
Abstract
1. Introduction
2. Related Works
2.1. Applicability of Sensors with AI Factors
2.2. Problems Integrating AI Sensors with Industrial Systems
2.3. State of the AI-Powered Smart Sensor Market
3. Characteristics of Smart Sensors with AI
3.1. Functional Difference Between an Intelligent Sensor and a Sensor with Built-In AI
3.2. Hardware Components of an AI Sensor
3.3. Ways to Implement AI in Sensors
3.3.1. Embedded Software
- Machine learning algorithms train the sensor to recognize and analyze the objects, scenes, patterns, or behaviors in the collected data;
- Prediction and optimization models, based on past data to predict future events, optimize resources and processes, forecast trends, warn of anomalies, or optimize resources such as energy or time;
- Image and video processing algorithms that enable the recognition of objects, faces, motion, and other features in visual data;
- Interfaces for interaction and communication with other devices or systems allow the sensor to transmit data, receive commands, and integrate with various control and monitoring systems.
3.3.2. Cloud Data Synthesis
3.3.3. Hybrid Approach
3.3.4. Comparative Analysis and Evaluation of Possible Applications and Real-World Implementations Between Edge AI and Cloud AI
3.3.5. Types of AI Integrated into Sensors
4. Hardware Challenges in AI Sensors
5. Possible Approaches to Solving Sensor Hardware Challenges
5.1. Implementing AI Accelerators in Microprocessors of AI Sensors
5.2. Reducing Energy Consumption by Reducing the Volume of Data Processed
5.2.1. Transforming Sensor Data into Intelligent Data
5.2.2. Local Embedded Processing near the Sensor, Edge AI
5.2.3. Reducing the Accuracy of Collected Data
5.2.4. Data Compression and Optimization
5.3. Using Energy-Efficient Sensors and Minimizing Their Number in Sensor Networks
5.4. Using Modern Memory Technologies
6. Conclusions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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Sensor Types | By Technology, Managing the Functionality | List of Companies, Leading AI Sensors | Purpose of the Application |
---|---|---|---|
Light Position Pressure Navigation Temperature Ultrasonic Optical Motions | Machine learning, Natural language processing, Computer vision, Context-aware Computing data | Teledyne Tech. Incor., Goertek Inc., Yokogawa Electric Corp., Robert Bosch GmbH, Sensata Tech., Excelitas Tech. Corp., Sony Corp., Baidu, Inc. Hokuriku El. Industry Co., BAE Systems PLC, Oracle Corp., RELX PLC, Inc. Sensirion AG, Sensortek Tech. Corp., Silicon Sensing Systems Limited data. | Industrial support and process management in various industries such as power supply, agriculture, mechanical engineering, etc., smart home, innovative city management; monitoring, diagnostics of patients in healthcare; Autonomous driving of cars, etc. |
Characteristics | Smart Sensors | AI Sensors |
---|---|---|
Data processing | Local processing of essential data with predefined algorithms. Basic filtering | Working with AI algorithms, machine learning, neural networks, and pattern recognition |
Adaptivity | Adaptability is limited | Self-learning models |
Noise filtering | Filtering through specific mathematical algorithms | Self-learning noise and detecting anomalies |
Calibration | Manual or semi-automatic | Automatic with AI-based corrections |
Real-time solutions | Fast responses, but with limited complexity | Autonomous decision-making based on more complex AI analyses |
Network integration | Connectivity with IoT platforms and industrial protocols | Integration with AI-based networks and self-learning |
Energy consumption | Lower | Higher |
Predictive analysis | Limited | Autonomous |
Energy efficiency | Lower energy consumption | Algorithm-dependent |
Communication | Local or cloud | Mostly local |
Latency | Minimal | Depends on the algorithm |
Complexity of implementation | Easy | Complex implementation and training of AI models |
Applications | Industrial automation, medicine, IoT, and more | Autonomous vehicles, Industry 4.0, customized solutions |
Benefits | Lower energy consumption Easier integration and reliability | Self-learning, adaptation, prediction, trends, autonomy, independence from external computing resources |
Disadvantages | Limited adaptation to new conditions and inability to process complex unstructured data. Making complex decisions through external systems | Higher consumption, Requires training and setup, Complex implementation and maintenance |
Characteristic | Smart Sensor | AI Sensor |
---|---|---|
Processor (CPU/MCU/AI chip) | Low-power microcontroller (MCU) | High-performance CPU/GPU/NPU for AI computing |
Memory (RAM/Flash/EEPROM) | Small amount of RAM and Flash memory for basic operations | More RAM and NAND/SSD memory for processing complex AI algorithms |
Analog-to-digital converter (ADC) | Built-in low-resolution ADC (10–12 bits) | High-precision ADC (16–24 bits) for processing complex data |
Sensor module | Basic sensor element (temperature, pressure, motion) | Advanced sensors (lidar, infrared, multispectral) |
Embedded algorithms | Fixed filtering and calibration algorithms | Dynamic algorithms for machine learning and neural networks |
Neural processing unit (NPU) | Lacks | Dedicated NPU for AI computing |
Communication interfaces | 2C, SPI, UART, RS-485 | I2C, SPI, UART, RS485 + Ethernet, Wi-Fi, 5G, Edge AI |
Power consumption | Low (few milliwatts) | Higher (watts to tens of watts) for complex processing |
Power supply | Batteries, energy-efficient solutions | High-performance power supplies (12 V, 24 V, PoE) |
Form factor | Compact, integrated into IoT devices | Larger size due to additional AI hardware |
Thermal management | Minimal heat dissipation, no active cooling required | Higher due to powerful hardware and AI capabilities |
Price | Lower, affordable mass production | May require heatsinks or active cooling (fans) |
Characteristic | Smart Sensor | AI Sensor |
---|---|---|
Processor | Microcontroller (MCU) with basic processing | Powerful processor (MCU + NPU) for AI analysis |
Memory | A little RAM (2–32 KB) и Flash (up 256 KB) | Expanded RAM (512 MB–4 GB) and NAND/SSD |
Sensor module | Capacitive or resistive sensor for moisture measurement | Advanced multi-channel capacitive sensor with ML processing |
Analog-to-digital converter (ADC) | 10–12 bits for basic measurements | 16–24 bits for precise humidity analysis |
Embedded algorithms | Fixed calibration and noise reduction algorithms | Dynamic machine learning for improved accuracy |
Neural processing unit (NPU) | Missing | Specialized NPU for real-time data analysis |
Communication interfaces | I2C, SPI, UART, RS-485 | I2C, SPI, UART, RS485 + Ethernet, Wi-Fi, 5G, Edge AI |
Power consumption | Low (1–5 mW) | Higher (200–500 mW) due to AI calculations |
Power supply | 3 V–5 V DC | 5 V–12 V DC or PoE |
Form factor | Compact, suitable for IoT devices | Bigger due to additional AI processing hardware |
Thermal management | Minimal heat dissipation | Possible need for a heat sink for high computing power |
Price | Lower (USD 5–USD 50) | Higher (USD 50–USD 300) |
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Tsvetanov, F. Hardware Challenges in AI Sensors and Innovative Approaches to Overcome Them. Eng. Proc. 2025, 104, 19. https://doi.org/10.3390/engproc2025104019
Tsvetanov F. Hardware Challenges in AI Sensors and Innovative Approaches to Overcome Them. Engineering Proceedings. 2025; 104(1):19. https://doi.org/10.3390/engproc2025104019
Chicago/Turabian StyleTsvetanov, Filip. 2025. "Hardware Challenges in AI Sensors and Innovative Approaches to Overcome Them" Engineering Proceedings 104, no. 1: 19. https://doi.org/10.3390/engproc2025104019
APA StyleTsvetanov, F. (2025). Hardware Challenges in AI Sensors and Innovative Approaches to Overcome Them. Engineering Proceedings, 104(1), 19. https://doi.org/10.3390/engproc2025104019