Choi, M.; Lee, Y.; Cho, C.; Jeong, W.; Seong, I.; Haque, J.M.E.; Choi, B.; Seo, S.; Kim, S.; You, S.;
et al. Plasma Dielectric Etching with C4H2F6 Isomers of Low Global-Warming Potential. J. Manuf. Mater. Process. 2025, 9, 42.
https://doi.org/10.3390/jmmp9020042
AMA Style
Choi M, Lee Y, Cho C, Jeong W, Seong I, Haque JME, Choi B, Seo S, Kim S, You S,
et al. Plasma Dielectric Etching with C4H2F6 Isomers of Low Global-Warming Potential. Journal of Manufacturing and Materials Processing. 2025; 9(2):42.
https://doi.org/10.3390/jmmp9020042
Chicago/Turabian Style
Choi, Minsu, Youngseok Lee, Chulhee Cho, Wonnyoung Jeong, Inho Seong, Jami Md Ehsanul Haque, Byeongyeop Choi, Seonghyun Seo, Sijun Kim, Shinjae You,
and et al. 2025. "Plasma Dielectric Etching with C4H2F6 Isomers of Low Global-Warming Potential" Journal of Manufacturing and Materials Processing 9, no. 2: 42.
https://doi.org/10.3390/jmmp9020042
APA Style
Choi, M., Lee, Y., Cho, C., Jeong, W., Seong, I., Haque, J. M. E., Choi, B., Seo, S., Kim, S., You, S., & Yeom, G. Y.
(2025). Plasma Dielectric Etching with C4H2F6 Isomers of Low Global-Warming Potential. Journal of Manufacturing and Materials Processing, 9(2), 42.
https://doi.org/10.3390/jmmp9020042
