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Journal: Journal of Manufacturing and Materials ProcessingVolume: 7Number: 139
Article: Analysis of Tempering Effects on LDS-MID and PCB Substrates for HF Applications
  • Authors:
  • Marius Wolf1,2,*,
  • Kai Werum1,2 and
  • Thomas Guenther1,2
  • et al.
Link: https://www.mdpi.com/2504-4494/7/4/139

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