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Journal: J. Manuf. Mater. Process., 2023
Volume: 7
Number: 139

Article: Analysis of Tempering Effects on LDS-MID and PCB Substrates for HF Applications
Authors: by Marius Wolf, Kai Werum, Thomas Guenther, Lisa Schleeh, Wolfgang Eberhardt and André Zimmermann
Link: https://www.mdpi.com/2504-4494/7/4/139

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