Wolf, M.; Werum, K.; Guenther, T.; Schleeh, L.; Eberhardt, W.; Zimmermann, A.
Analysis of Tempering Effects on LDS-MID and PCB Substrates for HF Applications. J. Manuf. Mater. Process. 2023, 7, 139.
https://doi.org/10.3390/jmmp7040139
AMA Style
Wolf M, Werum K, Guenther T, Schleeh L, Eberhardt W, Zimmermann A.
Analysis of Tempering Effects on LDS-MID and PCB Substrates for HF Applications. Journal of Manufacturing and Materials Processing. 2023; 7(4):139.
https://doi.org/10.3390/jmmp7040139
Chicago/Turabian Style
Wolf, Marius, Kai Werum, Thomas Guenther, Lisa Schleeh, Wolfgang Eberhardt, and André Zimmermann.
2023. "Analysis of Tempering Effects on LDS-MID and PCB Substrates for HF Applications" Journal of Manufacturing and Materials Processing 7, no. 4: 139.
https://doi.org/10.3390/jmmp7040139
APA Style
Wolf, M., Werum, K., Guenther, T., Schleeh, L., Eberhardt, W., & Zimmermann, A.
(2023). Analysis of Tempering Effects on LDS-MID and PCB Substrates for HF Applications. Journal of Manufacturing and Materials Processing, 7(4), 139.
https://doi.org/10.3390/jmmp7040139