Bornemann, S.; Rittmeier, L.; Roloff, T.; Haus, J.N.; Polle, C.; Herrmann, A.S.; Dietzel, A.; Sinapius, M.; Lang, W.; Lüssem, B.
Toward Material-Integrated Wireless Electronics for SHM in Fiber Metal Laminates. Proceedings 2024, 97, 141.
https://doi.org/10.3390/proceedings2024097141
AMA Style
Bornemann S, Rittmeier L, Roloff T, Haus JN, Polle C, Herrmann AS, Dietzel A, Sinapius M, Lang W, Lüssem B.
Toward Material-Integrated Wireless Electronics for SHM in Fiber Metal Laminates. Proceedings. 2024; 97(1):141.
https://doi.org/10.3390/proceedings2024097141
Chicago/Turabian Style
Bornemann, Sarah, Liv Rittmeier, Thomas Roloff, Jan N. Haus, Christoph Polle, Axel S. Herrmann, Andreas Dietzel, Michael Sinapius, Walter Lang, and Björn Lüssem.
2024. "Toward Material-Integrated Wireless Electronics for SHM in Fiber Metal Laminates" Proceedings 97, no. 1: 141.
https://doi.org/10.3390/proceedings2024097141
APA Style
Bornemann, S., Rittmeier, L., Roloff, T., Haus, J. N., Polle, C., Herrmann, A. S., Dietzel, A., Sinapius, M., Lang, W., & Lüssem, B.
(2024). Toward Material-Integrated Wireless Electronics for SHM in Fiber Metal Laminates. Proceedings, 97(1), 141.
https://doi.org/10.3390/proceedings2024097141
