Luo, X.; Niu, C.; Zhu, Z.; Hou, Y.; Jiang, H.; Tang, X.
Prediction of Extensibility and Toughness of Wheat-Flour Dough Using Bubble Inflation–Structured Light Scanning 3D Imaging Technology and the Enhanced 3D Vgg11 Model. Foods 2025, 14, 1295.
https://doi.org/10.3390/foods14081295
AMA Style
Luo X, Niu C, Zhu Z, Hou Y, Jiang H, Tang X.
Prediction of Extensibility and Toughness of Wheat-Flour Dough Using Bubble Inflation–Structured Light Scanning 3D Imaging Technology and the Enhanced 3D Vgg11 Model. Foods. 2025; 14(8):1295.
https://doi.org/10.3390/foods14081295
Chicago/Turabian Style
Luo, Xiuzhi, Changhe Niu, Zhaoshuai Zhu, Yuxin Hou, Hong Jiang, and Xiuying Tang.
2025. "Prediction of Extensibility and Toughness of Wheat-Flour Dough Using Bubble Inflation–Structured Light Scanning 3D Imaging Technology and the Enhanced 3D Vgg11 Model" Foods 14, no. 8: 1295.
https://doi.org/10.3390/foods14081295
APA Style
Luo, X., Niu, C., Zhu, Z., Hou, Y., Jiang, H., & Tang, X.
(2025). Prediction of Extensibility and Toughness of Wheat-Flour Dough Using Bubble Inflation–Structured Light Scanning 3D Imaging Technology and the Enhanced 3D Vgg11 Model. Foods, 14(8), 1295.
https://doi.org/10.3390/foods14081295