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Journal: Processes, 2024
Volume: 12
Number: 2142

Article: A Feasibility Study for the Hot-Air-Assisted Reflow Soldering Process Based on Computational Fluid Dynamics
Authors: by Natcha Kanjad, Chanapat Chanbandit and Jatuporn Thongsri
Link: https://www.mdpi.com/2227-9717/12/10/2142

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