Test and Analysis of the Heat Dissipation Effect of the Spindle Heat Conductive Path Based on the IPTO Algorithm
Round 1
Reviewer 1 Report
The biggest issue with this paper is that I do not see how this manuscript adds to the current body of knowledge. In other words, the conclusions seem too generic. It is very obvious that the heat conductive path will enhance heat dissipation from the spindle. Therefore, I encourage the authors to resubmit the manuscript when they have something novel to report.
Following are some of my additional comments:
1. I believe the authors need to provide a detailed explanation of the IPTO algorithm.
2. We need a schematic for the experimental apparatus. A photograph of the apparatus as shown in Figure 3 is not as impactful.
I encourage the authors to fix all grammatical/structural/syntactic errors. For instance, in line 36, replace "was different" by "were different".
Author Response
Please see the attachment.
Author Response File: Author Response.pdf
Reviewer 2 Report
In this article, the authors have investigated experimentally, the heat conductive path of the spindle based on the IPTO algorithm in order to reduce the spindle temperature rise and enhance the spindle heat dissipation capability. They computed the thermal characteristics of water- cooled and air-cooled heat conductive paths with different volume proportions to test the temperature rise of the spindle and analyze the effect of the heat conductive path with different volume proportions on the temperature distribution of the spindle.
The work, presentation and results are satisfactory. The following minor suggestion are proposed for acceptance of this article.
· Typo mistakes like in line 41, 301 etc.
· No reference of IPTO algorithm is provided in the literature review section.
· IPTO stands for?
· Add Reference of Eq. 1
· There should be some comparison how the Fig. 1 is optimal?
· The implementation of IPTO is missing in Section 2.1. Is this algorithm is using results of Ref. 12? Add the reference of Software/code this. More details should be added.
No.
Author Response
Please see the attachment.
Author Response File: Author Response.pdf