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Journal: Processes, 2023
Volume: 11
Number: 2052
2052
Article: Research on the Disassembly Process and Model of Waste Mobile Phone Circuit Board Components
Authors: by Yuxuan Jiang, Min Zhao, Litao Zhao, Qin Chen, Qing Huang, Xiaolong Song, Chenglong Zhang and Jingwei Wang
Link: https://www.mdpi.com/2227-9717/11/7/2052

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