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Journal: Processes, 2023
Volume: 11
Number: 1177
Article:
High-Speed Laser Cutting Silicon-Glass Double Layer Wafer with Laser-Induced Thermal-Crack Propagation
Authors:
by
Chunyang Zhao, Zhihui Yang, Shuo Kang, Xiuhong Qiu and Bin Xu
Link:
https://www.mdpi.com/2227-9717/11/4/1177
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