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Journal: Processes, 2023
Volume: 11
Number: 1032

Article: Efficient Non-Destructive Detection of Interface Adhesion State by Interfacial Thermal Conductance: A Molecular Dynamics Study
Authors: by Jianhua Guo, Niping Ma, Jiale Chen and Ning Wei
Link: https://www.mdpi.com/2227-9717/11/4/1032

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