Chen, C.; Wang, C.; Sun, H.; Yin, H.; Gao, X.; Xue, H.; Ni, D.; Bian, K.; Gu, Q.
Interfacial Microstructure and Mechanical Reliability of Sn-58Bi/ENEPIG Solder Joints. Processes 2022, 10, 295.
https://doi.org/10.3390/pr10020295
AMA Style
Chen C, Wang C, Sun H, Yin H, Gao X, Xue H, Ni D, Bian K, Gu Q.
Interfacial Microstructure and Mechanical Reliability of Sn-58Bi/ENEPIG Solder Joints. Processes. 2022; 10(2):295.
https://doi.org/10.3390/pr10020295
Chicago/Turabian Style
Chen, Cheng, Cheng Wang, Huhao Sun, Hongbo Yin, Xiuli Gao, Hengxu Xue, Dahai Ni, Kan Bian, and Qilin Gu.
2022. "Interfacial Microstructure and Mechanical Reliability of Sn-58Bi/ENEPIG Solder Joints" Processes 10, no. 2: 295.
https://doi.org/10.3390/pr10020295
APA Style
Chen, C., Wang, C., Sun, H., Yin, H., Gao, X., Xue, H., Ni, D., Bian, K., & Gu, Q.
(2022). Interfacial Microstructure and Mechanical Reliability of Sn-58Bi/ENEPIG Solder Joints. Processes, 10(2), 295.
https://doi.org/10.3390/pr10020295