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Journal: Mathematics, 2022
Volume: 10
Number: 1913
Article:
Thermomechanical Optimization of Three-Dimensional Low Heat Generation Microelectronic Packaging Using the Boundary Element Method
Authors:
by
José Vallepuga-Espinosa, Jaime Cifuentes-RodrÃguez, VÃctor Gutiérrez-Posada and Iván Ubero-MartÃnez
Link:
https://www.mdpi.com/2227-7390/10/11/1913
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