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Journal: Mathematics, 2022
Volume: 10
Number: 1913

Article: Thermomechanical Optimization of Three-Dimensional Low Heat Generation Microelectronic Packaging Using the Boundary Element Method
Authors: by José Vallepuga-Espinosa, Jaime Cifuentes-Rodríguez, Víctor Gutiérrez-Posada and Iván Ubero-Martínez
Link: https://www.mdpi.com/2227-7390/10/11/1913

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