Ant Colony Algorithm for Energy Saving to Optimize Three-Dimensional Bonding Chips’ Thermal Layout
Abstract
:1. Introduction
2. Description of Chip Layout
2.1. Establishment of Ant Colony Optimization Model
2.2. The Selection of Fitness Function
2.3. Algorithm Steps
3. Simulation Results and Analysis of the Algorithm
4. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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Sun, B.; Yang, P.; Zhu, Z. Ant Colony Algorithm for Energy Saving to Optimize Three-Dimensional Bonding Chips’ Thermal Layout. Technologies 2023, 11, 122. https://doi.org/10.3390/technologies11050122
Sun B, Yang P, Zhu Z. Ant Colony Algorithm for Energy Saving to Optimize Three-Dimensional Bonding Chips’ Thermal Layout. Technologies. 2023; 11(5):122. https://doi.org/10.3390/technologies11050122
Chicago/Turabian StyleSun, Bihao, Peizhi Yang, and Zhiyuan Zhu. 2023. "Ant Colony Algorithm for Energy Saving to Optimize Three-Dimensional Bonding Chips’ Thermal Layout" Technologies 11, no. 5: 122. https://doi.org/10.3390/technologies11050122