# Ant Colony Algorithm for Energy Saving to Optimize Three-Dimensional Bonding Chips’ Thermal Layout

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## Abstract

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## 1. Introduction

## 2. Description of Chip Layout

^{2}K. The heat generation rate is applied to the unit as a bulk load, and the heat generation rate of the chip is equal to the power per unit volume of the chip.

#### 2.1. Establishment of Ant Colony Optimization Model

#### 2.2. The Selection of Fitness Function

#### 2.3. Algorithm Steps

## 3. Simulation Results and Analysis of the Algorithm

## 4. Conclusions

## Author Contributions

## Funding

## Institutional Review Board Statement

## Informed Consent Statement

## Data Availability Statement

## Conflicts of Interest

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**MDPI and ACS Style**

Sun, B.; Yang, P.; Zhu, Z.
Ant Colony Algorithm for Energy Saving to Optimize Three-Dimensional Bonding Chips’ Thermal Layout. *Technologies* **2023**, *11*, 122.
https://doi.org/10.3390/technologies11050122

**AMA Style**

Sun B, Yang P, Zhu Z.
Ant Colony Algorithm for Energy Saving to Optimize Three-Dimensional Bonding Chips’ Thermal Layout. *Technologies*. 2023; 11(5):122.
https://doi.org/10.3390/technologies11050122

**Chicago/Turabian Style**

Sun, Bihao, Peizhi Yang, and Zhiyuan Zhu.
2023. "Ant Colony Algorithm for Energy Saving to Optimize Three-Dimensional Bonding Chips’ Thermal Layout" *Technologies* 11, no. 5: 122.
https://doi.org/10.3390/technologies11050122