Li, T.; Hou, J.; Yan, J.; Liu, R.; Yang, H.; Sun, Z.
Chiplet Heterogeneous Integration Technology—Status and Challenges. Electronics 2020, 9, 670.
https://doi.org/10.3390/electronics9040670
AMA Style
Li T, Hou J, Yan J, Liu R, Yang H, Sun Z.
Chiplet Heterogeneous Integration Technology—Status and Challenges. Electronics. 2020; 9(4):670.
https://doi.org/10.3390/electronics9040670
Chicago/Turabian Style
Li, Tao, Jie Hou, Jinli Yan, Rulin Liu, Hui Yang, and Zhigang Sun.
2020. "Chiplet Heterogeneous Integration Technology—Status and Challenges" Electronics 9, no. 4: 670.
https://doi.org/10.3390/electronics9040670
APA Style
Li, T., Hou, J., Yan, J., Liu, R., Yang, H., & Sun, Z.
(2020). Chiplet Heterogeneous Integration Technology—Status and Challenges. Electronics, 9(4), 670.
https://doi.org/10.3390/electronics9040670