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Electronics 2016, 5(4), 61;

A Raspberry Pi Cluster Instrumented for Fine-Grained Power Measurement

Electrical and Computer Engineering, University of Maine, Orono, ME 04469, USA
This paper is an extended version of our paper published in 2014 First International Workshop on Hardware-Software Co-Design for High Performance Computing, New Orleans, LA, USA, 16–21 November 2014.
Author to whom correspondence should be addressed.
Academic Editors: Simon J. Cox and Steven J. Johnston
Received: 30 April 2016 / Revised: 9 September 2016 / Accepted: 13 September 2016 / Published: 23 September 2016
(This article belongs to the Special Issue Raspberry Pi Technology)
Full-Text   |   PDF [507 KB, uploaded 23 September 2016]   |  


Power consumption has become an increasingly important metric when building large supercomputing clusters. One way to reduce power usage in large clusters is to use low-power embedded processors rather than the more typical high-end server CPUs (central processing units). We investigate various power-related metrics for seventeen different embedded ARM development boards in order to judge the appropriateness of using them in a computing cluster. We then build a custom cluster out of Raspberry Pi boards, which is specially designed for per-node detailed power measurement. In addition to serving as an embedded cluster testbed, our cluster’s power measurement, visualization and thermal features make it an excellent low-cost platform for education and experimentation. View Full-Text
Keywords: Raspberry Pi; embedded supercomputers; GFLOPS/W; cluster construction; power measurement Raspberry Pi; embedded supercomputers; GFLOPS/W; cluster construction; power measurement

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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

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Cloutier, M.F.; Paradis, C.; Weaver, V.M. A Raspberry Pi Cluster Instrumented for Fine-Grained Power Measurement. Electronics 2016, 5, 61.

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