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Coutu RA, Lake RA, Christiansen BD, Heller ER, Bozada CA, Poling BS, Via GD, Theimer JP, Tetlak SE, Vetury R, et al. Benefits of Considering More than Temperature Acceleration for GaN HEMT Life Testing. Electronics. 2016; 5(3):32. https://doi.org/10.3390/electronics5030032

Coutu, Ronald A., Robert A. Lake, Bradley D. Christiansen, Eric R. Heller, Christopher A. Bozada, Brian S. Poling, Glen D. Via, James P. Theimer, Stephen E. Tetlak, Ramakrishna Vetury, and et al. 2016. "Benefits of Considering More than Temperature Acceleration for GaN HEMT Life Testing" Electronics 5, no. 3: 32. https://doi.org/10.3390/electronics5030032

Coutu, R. A., Lake, R. A., Christiansen, B. D., Heller, E. R., Bozada, C. A., Poling, B. S., Via, G. D., Theimer, J. P., Tetlak, S. E., Vetury, R., & Shealy, J. B. (2016). Benefits of Considering More than Temperature Acceleration for GaN HEMT Life Testing. Electronics, 5(3), 32. https://doi.org/10.3390/electronics5030032