Electrical Reliability of a Film-Type Connection during Bending
Abstract
:1. Introduction
2. Methods
2.1. Fabrication of the Film-Type Connector
2.2. Connection Process of the Film-Type Connector
2.3. Preparation of Samples
Description | Specification |
---|---|
PI film thickness | 7.5 µm |
Electrode thickness | Cu/Ni/Au = 9/0.5/0.1 µm |
Electrode pitch | 100 µm (line/space = 40/60 µm) |
Number of electrodes | 192 |
Adhesive thickness | 50 µm |
PET substrate thickness | 25 µm |
2.4. Measurement of the Electrical Resistance of the Samples
2.5. Procedure of the Bending Test
3. Results and Discussion
3.1. Characteristics of the Film-Type Connection
3.2. Bending Tests
4. Conclusions
Author Contributions
Conflicts of Interest
References
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Mitsui, R.; Sato, J.; Takahashi, S.; Nakajima, S.-i. Electrical Reliability of a Film-Type Connection during Bending. Electronics 2015, 4, 827-846. https://doi.org/10.3390/electronics4040827
Mitsui R, Sato J, Takahashi S, Nakajima S-i. Electrical Reliability of a Film-Type Connection during Bending. Electronics. 2015; 4(4):827-846. https://doi.org/10.3390/electronics4040827
Chicago/Turabian StyleMitsui, Ryosuke, Junya Sato, Seiya Takahashi, and Shin-ichiro Nakajima. 2015. "Electrical Reliability of a Film-Type Connection during Bending" Electronics 4, no. 4: 827-846. https://doi.org/10.3390/electronics4040827