Order Article Reprints

Jiang T, Hu H, Wang H, Yin Q, Lin P, Wei Y, Xu Y, Wang Y, Hong F. Precision Hotspot Mitigation in Wafer-Level Electroplating with Novel Auxiliary Electrode Design for Advanced Large-Scale Chip Packaging. Electronics. 2025; 14(5):944. https://doi.org/10.3390/electronics14050944

Jiang, Tao, Huiyong Hu, He Wang, Qiongling Yin, Pengpeng Lin, Yongyan Wei, Yanan Xu, Yitian Wang, and Feng Hong. 2025. "Precision Hotspot Mitigation in Wafer-Level Electroplating with Novel Auxiliary Electrode Design for Advanced Large-Scale Chip Packaging" Electronics 14, no. 5: 944. https://doi.org/10.3390/electronics14050944

Jiang, T., Hu, H., Wang, H., Yin, Q., Lin, P., Wei, Y., Xu, Y., Wang, Y., & Hong, F. (2025). Precision Hotspot Mitigation in Wafer-Level Electroplating with Novel Auxiliary Electrode Design for Advanced Large-Scale Chip Packaging. Electronics, 14(5), 944. https://doi.org/10.3390/electronics14050944