Jiang, T.; Hu, H.; Wang, H.; Yin, Q.; Lin, P.; Wei, Y.; Xu, Y.; Wang, Y.; Hong, F.
Precision Hotspot Mitigation in Wafer-Level Electroplating with Novel Auxiliary Electrode Design for Advanced Large-Scale Chip Packaging. Electronics 2025, 14, 944.
https://doi.org/10.3390/electronics14050944
AMA Style
Jiang T, Hu H, Wang H, Yin Q, Lin P, Wei Y, Xu Y, Wang Y, Hong F.
Precision Hotspot Mitigation in Wafer-Level Electroplating with Novel Auxiliary Electrode Design for Advanced Large-Scale Chip Packaging. Electronics. 2025; 14(5):944.
https://doi.org/10.3390/electronics14050944
Chicago/Turabian Style
Jiang, Tao, Huiyong Hu, He Wang, Qiongling Yin, Pengpeng Lin, Yongyan Wei, Yanan Xu, Yitian Wang, and Feng Hong.
2025. "Precision Hotspot Mitigation in Wafer-Level Electroplating with Novel Auxiliary Electrode Design for Advanced Large-Scale Chip Packaging" Electronics 14, no. 5: 944.
https://doi.org/10.3390/electronics14050944
APA Style
Jiang, T., Hu, H., Wang, H., Yin, Q., Lin, P., Wei, Y., Xu, Y., Wang, Y., & Hong, F.
(2025). Precision Hotspot Mitigation in Wafer-Level Electroplating with Novel Auxiliary Electrode Design for Advanced Large-Scale Chip Packaging. Electronics, 14(5), 944.
https://doi.org/10.3390/electronics14050944
