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Journal: Electronics, 2025
Volume: 14
Number: 314
314
Article: Cooling Methods for a Typical Printed Circuit Board Assembly in Spacecraft: Simulation and Experiment
Authors: by Sheng Wang, Changxu Song, Li Zhang, Fengjiao Hu, Feng Dong, Dapeng Liang, Jiangtao Liu, Jingyu Zhang and Sihong Chen
Link: https://www.mdpi.com/2079-9292/14/2/314

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