Next Article in Journal
AI-Enabled Sustainable Manufacturing: Intelligent Package Integrity Monitoring for Waste Reduction in Supply Chains
Previous Article in Journal
An Enhanced Approach for Sound Speed Profiles Inversion Using Remote Sensing Data: Sample Clustering and Physical Regression
 
 
Article

Article Versions Notes

Electronics 2025, 14(14), 2823; https://doi.org/10.3390/electronics14142823
Action Date Notes Link
article xml file uploaded 14 July 2025 12:56 CEST Original file -
article xml uploaded. 14 July 2025 12:56 CEST Update https://www.mdpi.com/2079-9292/14/14/2823/xml
article pdf uploaded. 14 July 2025 12:56 CEST Version of Record https://www.mdpi.com/2079-9292/14/14/2823/pdf
article html file updated 14 July 2025 13:00 CEST Original file https://www.mdpi.com/2079-9292/14/14/2823/html
Back to TopTop