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Journal: Electronics, 2024
Volume: 13
Number: 4465

Article: A Thermal Impedance Model for IGBT Modules Considering the Nonlinear Thermal Characteristics of Chips and Ceramic Materials
Authors: by Yingying Wang, Zuhuo Liang, Bolin Jin and Jindi Pang
Link: https://www.mdpi.com/2079-9292/13/22/4465

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