Order Article Reprints
Journal: Electronics, 2024
Volume: 13
Number: 4465
Article:
A Thermal Impedance Model for IGBT Modules Considering the Nonlinear Thermal Characteristics of Chips and Ceramic Materials
Authors:
by
Yingying Wang, Zuhuo Liang, Bolin Jin and Jindi Pang
Link:
https://www.mdpi.com/2079-9292/13/22/4465
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.