Deng, T.; Wang, H.; He, D.; Xiong, N.; Liang, W.; Wang, J.
Multi-Dimensional Fusion Deep Learning for Side Channel Analysis. Electronics 2023, 12, 4728.
https://doi.org/10.3390/electronics12234728
AMA Style
Deng T, Wang H, He D, Xiong N, Liang W, Wang J.
Multi-Dimensional Fusion Deep Learning for Side Channel Analysis. Electronics. 2023; 12(23):4728.
https://doi.org/10.3390/electronics12234728
Chicago/Turabian Style
Deng, Tuo, Huanyu Wang, Dalin He, Naixue Xiong, Wei Liang, and Junnian Wang.
2023. "Multi-Dimensional Fusion Deep Learning for Side Channel Analysis" Electronics 12, no. 23: 4728.
https://doi.org/10.3390/electronics12234728
APA Style
Deng, T., Wang, H., He, D., Xiong, N., Liang, W., & Wang, J.
(2023). Multi-Dimensional Fusion Deep Learning for Side Channel Analysis. Electronics, 12(23), 4728.
https://doi.org/10.3390/electronics12234728