Zhang, P.; Wang, D.-W.; Zhao, W.-S.; Su, J.; You, B.; Liu, J.
Multiphysics Analysis and Optimal Design of Compressible Micro-Interconnect for 2.5D/3D Heterogeneous Integration. Electronics 2021, 10, 2240.
https://doi.org/10.3390/electronics10182240
AMA Style
Zhang P, Wang D-W, Zhao W-S, Su J, You B, Liu J.
Multiphysics Analysis and Optimal Design of Compressible Micro-Interconnect for 2.5D/3D Heterogeneous Integration. Electronics. 2021; 10(18):2240.
https://doi.org/10.3390/electronics10182240
Chicago/Turabian Style
Zhang, Peng, Da-Wei Wang, Wen-Sheng Zhao, Jiangtao Su, Bin You, and Jun Liu.
2021. "Multiphysics Analysis and Optimal Design of Compressible Micro-Interconnect for 2.5D/3D Heterogeneous Integration" Electronics 10, no. 18: 2240.
https://doi.org/10.3390/electronics10182240
APA Style
Zhang, P., Wang, D.-W., Zhao, W.-S., Su, J., You, B., & Liu, J.
(2021). Multiphysics Analysis and Optimal Design of Compressible Micro-Interconnect for 2.5D/3D Heterogeneous Integration. Electronics, 10(18), 2240.
https://doi.org/10.3390/electronics10182240