Next Article in Journal
Inferring the Hidden Cascade Infection over Erdös-Rényi (ER) Random Graph
Previous Article in Journal
Spectral Classification Based on Deep Learning Algorithms
 
 

Order Article Reprints

Journal: Electronics, 2021
Volume: 10
Number: 1893

Article: Design and Implementation of RF Front-End Module Based on 3D Heterogenous-Integrated Wafer-Level Packaging
Authors: by Faxin Yu, Qi Zhou, Zhiyu Wang, Jiongjiong Mo and Hua Chen
Link: https://www.mdpi.com/2079-9292/10/16/1893

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Quote and Order Details

Contact Person

Invoice Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop