Wu, N.; Zeng, L.; Fu, T.; Chen, J.; Zhang, F.; Zeng, Y.; Peng, S.
The Rapid Boiling of Thin Liquid Films with Different Thicknesses on Nanochannel Copper Plates: A Molecular Dynamics Study. Coatings 2023, 13, 2057.
https://doi.org/10.3390/coatings13122057
AMA Style
Wu N, Zeng L, Fu T, Chen J, Zhang F, Zeng Y, Peng S.
The Rapid Boiling of Thin Liquid Films with Different Thicknesses on Nanochannel Copper Plates: A Molecular Dynamics Study. Coatings. 2023; 13(12):2057.
https://doi.org/10.3390/coatings13122057
Chicago/Turabian Style
Wu, Nini, Liangcai Zeng, Ting Fu, Juan Chen, Feng Zhang, Yun Zeng, and Shuai Peng.
2023. "The Rapid Boiling of Thin Liquid Films with Different Thicknesses on Nanochannel Copper Plates: A Molecular Dynamics Study" Coatings 13, no. 12: 2057.
https://doi.org/10.3390/coatings13122057
APA Style
Wu, N., Zeng, L., Fu, T., Chen, J., Zhang, F., Zeng, Y., & Peng, S.
(2023). The Rapid Boiling of Thin Liquid Films with Different Thicknesses on Nanochannel Copper Plates: A Molecular Dynamics Study. Coatings, 13(12), 2057.
https://doi.org/10.3390/coatings13122057
