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Journal: Coatings, 2022
Volume: 12
Number: 1752

Article: Role of Crystallographic Orientation of β-Sn Grain on Electromigration Failures in Lead-Free Solder Joint: An Overview
Authors: by Muhammad Nasir Bashir, Sajid Ullah Butt, Muhammad Adil Mansoor, Niaz Bahadur Khan, Shahid Bashir, Yew Hoong Wong, Turki Alamro, Sayed Mohamed Eldin and Mohammed Jameel
Link: https://www.mdpi.com/2079-6412/12/11/1752

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