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Journal: Nanomaterials, 2024
Volume: 14
Number: 1834
Article:
A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects
Authors:
by
Ahmed Sobhi Saleh, Kristof Croes, Hajdin Ceric, Ingrid De Wolf and Houman Zahedmanesh
Link:
https://www.mdpi.com/2079-4991/14/22/1834
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