Majkowycz, K.; Murawski, K.; Kopytko, M.; Nowakowski-Szkudlarek, K.; Witkowska-Baran, M.; Martyniuk, P.
The Influence of Etching Method on the Occurrence of Defect Levels in III-V and II-VI Materials. Nanomaterials 2024, 14, 1612.
https://doi.org/10.3390/nano14191612
AMA Style
Majkowycz K, Murawski K, Kopytko M, Nowakowski-Szkudlarek K, Witkowska-Baran M, Martyniuk P.
The Influence of Etching Method on the Occurrence of Defect Levels in III-V and II-VI Materials. Nanomaterials. 2024; 14(19):1612.
https://doi.org/10.3390/nano14191612
Chicago/Turabian Style
Majkowycz, Kinga, Krzysztof Murawski, Małgorzata Kopytko, Krzesimir Nowakowski-Szkudlarek, Marta Witkowska-Baran, and Piotr Martyniuk.
2024. "The Influence of Etching Method on the Occurrence of Defect Levels in III-V and II-VI Materials" Nanomaterials 14, no. 19: 1612.
https://doi.org/10.3390/nano14191612
APA Style
Majkowycz, K., Murawski, K., Kopytko, M., Nowakowski-Szkudlarek, K., Witkowska-Baran, M., & Martyniuk, P.
(2024). The Influence of Etching Method on the Occurrence of Defect Levels in III-V and II-VI Materials. Nanomaterials, 14(19), 1612.
https://doi.org/10.3390/nano14191612