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Journal: Nanomaterials, 2023
Volume: 13
Number: 2642
2642
Article: Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films
Authors: by Ruhan E. Ustad, Vijay D. Chavan, Honggyun Kim, Min-ho Shin, Sung-Kyu Kim, Kyeong-Keun Choi and Deok-kee Kim
Link: https://www.mdpi.com/2079-4991/13/19/2642

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