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Journal: Nanomaterials, 2022
Volume: 12
Number: 1752
Article:
Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis
Authors:
by
Bruno M. C. Oliveira, Ruben F. Santos, Ana P. Piedade, Paulo J. Ferreira and Manuel F. Vieira
Link:
https://www.mdpi.com/2079-4991/12/10/1752
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