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Journal: Appl. Sci., 2017
Volume: 7
Number: 739
739
Article: Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges
Authors: by Meng-Chieh Liao, Pu-Shan Huang, Yi-Hsien Lin, Ming-Yi Tsai, Chen-Yu Huang and Te-Chin Huang
Link: https://www.mdpi.com/2076-3417/7/7/739

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