Liao, M.-C.; Huang, P.-S.; Lin, Y.-H.; Tsai, M.-Y.; Huang, C.-Y.; Huang, T.-C.
Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges. Appl. Sci. 2017, 7, 739.
https://doi.org/10.3390/app7070739
AMA Style
Liao M-C, Huang P-S, Lin Y-H, Tsai M-Y, Huang C-Y, Huang T-C.
Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges. Applied Sciences. 2017; 7(7):739.
https://doi.org/10.3390/app7070739
Chicago/Turabian Style
Liao, Meng-Chieh, Pu-Shan Huang, Yi-Hsien Lin, Ming-Yi Tsai, Chen-Yu Huang, and Te-Chin Huang.
2017. "Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges" Applied Sciences 7, no. 7: 739.
https://doi.org/10.3390/app7070739
APA Style
Liao, M.-C., Huang, P.-S., Lin, Y.-H., Tsai, M.-Y., Huang, C.-Y., & Huang, T.-C.
(2017). Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges. Applied Sciences, 7(7), 739.
https://doi.org/10.3390/app7070739