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Journal: Appl. Sci., 2024
Volume: 14
Number: 8114

Article: Thermal Interaction and Cooling of Electronic Device with Chiplet 2.5D Integration
Authors: by Jianyu Feng, Minghao Zhou, Chuan Chen, Qidong Wang and Liqiang Cao
Link: https://www.mdpi.com/2076-3417/14/18/8114

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