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Journal: Appl. Sci., 2023
Volume: 13
Number: 5209
5209
Article: Thermal Analysis and Junction Temperature Estimation under Different Ambient Temperatures Considering Convection Thermal Coupling between Power Devices
Authors: by Kaixin Wei, Peiji Shi, Pili Bao, Xianping Gao, Yang Du and Yanzhou Qin
Link: https://www.mdpi.com/2076-3417/13/8/5209

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