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Journal: Appl. Sci., 2023
Volume: 13
Number: 12653

Article: Effect of Thermal via Design on Heat Dissipation of High-Lead QFN Packages Mounted on PCB
Authors: by Ziyi Yuan, Dongyan Ding and Wenlong Zhang
Link: https://www.mdpi.com/2076-3417/13/23/12653

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