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Journal: Appl. Sci., 2021
Volume: 11
Number: 9769

Article: A Deep Convolutional Neural Network-Based Multi-Class Image Classification for Automatic Wafer Map Failure Recognition in Semiconductor Manufacturing
Authors: by Huilin Zheng, Syed Waseem Abbas Sherazi, Sang Hyeok Son and Jong Yun Lee
Link: https://www.mdpi.com/2076-3417/11/20/9769

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