Order Article Reprints
Journal: Appl. Sci., 2021
Volume: 11
Number: 9769
Article:
A Deep Convolutional Neural Network-Based Multi-Class Image Classification for Automatic Wafer Map Failure Recognition in Semiconductor Manufacturing
Authors:
by
Huilin Zheng, Syed Waseem Abbas Sherazi, Sang Hyeok Son and Jong Yun Lee
Link:
https://www.mdpi.com/2076-3417/11/20/9769
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.