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Metals 2019, 9(2), 241;

Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses

Department of Manufacturing and Materials Engineering, University of Campinas-UNICAMP, 13083-860 Campinas, Brazil
Department of Materials Engineering, Federal University of São Carlos-UFSCar, 13565-905 São Carlos, Brazil
Department of Materials Engineering, Federal University of Rio Grande do Norte-UFRN, 59078-970 Natal, Brazil
Campus of São João da Boa Vista, São Paulo State University-UNESP, 13876-750 São João da Boa Vista, Brazil
Author to whom correspondence should be addressed.
Received: 31 January 2019 / Revised: 11 February 2019 / Accepted: 12 February 2019 / Published: 17 February 2019
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In this study, experiments were conducted to analyze the effect of 0.05 and 0.1 wt.% Al additions during the unsteady-state growth of the Sn-0.5wt.%Cu solder alloy. Various as-solidified specimens of each alloy were selected so that tensile tests could also be performed. Microstructural aspects such as the dimensions of primary, λ1, and secondary, λ2, dendritic arrays, and intermetallic compounds (IMCs) morphologies were comparatively assessed for the three tested compositions, that is, Sn-0.5wt.%Cu, Sn-0.5wt.%Cu-0.05wt.%Al, and Sn-0.5wt.%Cu-0.1wt.%Al alloys. Al addition affected neither the primary dendritic spacing nor the types of morphologies identified for the Cu6Sn5 IMC, which was found to be either globular or fibrous regardless of the alloy considered. Secondary dendrite arm spacing was found to be enlarged and the eutectic fraction was reduced with an increase in the Al-content. Tensile properties remained unaffected with the addition of Al, except for the improvement in ductility of up to 40% when compared to the Sn-0.5wt.%Cu alloy without Al trace. A smaller λ2 in size was demonstrated to be the prime microstructure parameter associated with the beneficial effect on the strength of the Sn-0.5wt.%Cu(-x)Al alloys. View Full-Text
Keywords: Sn–Cu–Al alloys; solidification; microstructure; tensile strength Sn–Cu–Al alloys; solidification; microstructure; tensile strength

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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

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Lima, T.S.; de Gouveia, G.L.; da Silva Septimio, R.; da Cruz, C.B.; Silva, B.L.; Brito, C.; Spinelli, J.E.; Cheung, N. Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses. Metals 2019, 9, 241.

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